CER / CNR Series

Decoupling
Low ESL
  • Miniaturization
  • Low inductance
  • Capacitance
1pF ~ 270nF
  • Tolerance
±1%, ±2%, ±5%, ±10%, ±20%
  • Mounting
SMD
  • Operating Temp
-55°C ~ 125°C
  • RoHS
ROHS, Non ROHS
  • Voltage Rated DC
16V ~ 100V

Typical applications : 

  • Decoupling

 

The below Part Numbers reflect our high runners only
Please contact us if you can't find your specifications.

PN
Capacitance
Voltage Rated AC
Tolerance
Mounting
Operating Temp
RoHS
Voltage Rated DC
CNR12 - - C - - - 180nF +/-10% 25 V - - 180000pF - ±10% SMD - Non ROHS 25V
CNR12 - - C - - - 120nF +/-10% 50 V - - 120000pF - ±10% SMD - Non ROHS 50V
CNR12 - - C - - - 39nF+/-10% 100 V - - 39000pF - ±10% SMD - Non ROHS 100V
CNR14 - - C - - - 4700pF +/-10% 100 V - - 4700pF - ±10% SMD - Non ROHS 100V
CNR2 - - C - - - 22nF +/-10% 100 V - - 22000pF - ±10% SMD - Non ROHS 100V
Compliance and certifications
certification
CECC
certification
ESA
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Frequently Asked Questions

Find answers to the most frequently asked questions about our products and services.
What is Ceramic Capacitors

Excellent temperature resistance, high volume/capacitance ratio, electrical properties and reliability make Exxelia's ceramic capacitors ideal for a wide range of fields of application including medical implants, aircraft flight controls, switched-mode power supply in harsh environments, core samplers for petroleum exploration, and space vehicles. Exxelia also offers Hyper Frequency ceramic capacitors with optimized size and very low ESR. 

These HiQ capacitors offer excellent performance levels for RF applications requiring functional reliability. Typically these applications include civil and military telecommunications (cellular base station equipment, wireless broadband service, Point to-Point or Multipoint radios, radio broadcasting equipment), and MRI coils.

How is Ceramic used in Capacitors ?

Ceramic chips are created with binders and solvents added to a specified ceramic powder. The slurry created is dried, forming a sheet or tape of ceramic material. Metal powder is mixed with solvents and additional ceramic material to create a liquid electrode. The liquid is then printed onto the ceramic layer. Layers of the ceramic sheets are stacked and laminated to form a solid structure.

The solid structure is cut into the desired size. Once cutting is complete, the assembly must be kiln fired. The temperature used in the firing process is critical in determining the capacitor’s characteristics. The process is similar for disc and chip styles. Disc capacitors use long leads to mount through circuit boards. Chips use surface mount technology.

Benefits of Low Resistance and Low Self Inductance

Two major benefits of film capacitors comes from the fact that they have low equivalent series resistance and low self inductance. Due to these properties, they can be designed to withstand voltages in the kilovolts. Power film capacitors take these benefits even farther and can withstand reactive power over 200 volt amperes in charge. 

These types of benefits make them very attractive overall to a wide variety of different types of industries all over the world. Constructions costs can be slashed even farther through the use of special materials.

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