Transformers

A transformer’s function is to change the entry current/voltage level to another level while keeping the same power.

Electrical Functions

• Voltage transformation : V1 → V2 
• Isolation
• Measurement

Example : 

SMPS Transformers : Flyback, Forward, Push Pull, Half Bridge, Full Bridge, Dual Active Bridge, LLC transformers.
Pulse Transformers

• Gate Drive Transformers

• Data Bus 1553

   

Current  Transformers

Multi Pulse Transformer for “400Hz” Power Supply 
50/60 Hz Transformer for Niche Markets
 

• High Power Applications: Essential for electric & hybrid vehicles (airplane, EVTOL, buses, heavy vehicles, off-road), energy storage systems and Smart Grid distribution networks.
• High Efficiency: Maximizes energy performance and reduces losses.
• High Frequency Operation: More compact and lighter designs for easy integration.
• Compatibility with SiC and GaN: Take advantage of the latest generation semiconductors for optimal performance.
• Bidirectional Transfer: Essential for modern systems requiring reversible power transfers.
• Reduced EMI: Improved electromagnetic compatibility for reliable operation.

• Miniaturization: Design smaller systems without sacrificing performance.
• Thermal and loss management: Reduce losses and thus thermal to improve sustainability and efficiency.
• Balancing Effectiveness and Cost: Finding cost-effective solutions while maximizing efficiency.
• Guaranteeing an integrated component (choke + transformer), whatever the inductance value! : More compact + Better EMC performance.
• Components with optimal performance: Efficiency >99% even at high frequency.
• Products with controlled costs: Guaranteeing simpler integration favoring optimized system costs.
• Offering better thermal management: Components designed to manage and dissipate heat efficiently.

Cleaning procedure 

The cleaning of the PCB boards is evolving from solvent (as isopropylic alcohol,...) to highly alkaline water based cleaning medium. EXXELIA has performed an extensive study to offer robust technologies to withstand these current cleaning processes. The qualification procedure has included thermal shock, burn in and mechanical testings. EXXELIA has defined gluing, marking, varnishing processes that allow the products to go through more than 5 cleaning cycles and operating up to 180°C. 

Processes compliant to ESA and NASA outgassing standards have also been defined for products specified up to 140°C. 

Wire integrity 

EXXELIA has qualified specific processes to ensure wire integrity for better insulation. The wire undergoes mechanical, chemical and thermal stresses during the winding and cabling process steps. EXXELIA has set up a dedicated process to reduce the impact of these manufacturing steps and improve the overall reliability of the wires and products. 

Finishing 

EXXELIA offers several types of components: Surface Mounted Device, Through Hole or lead terminations products, system integrated components. 

Packaging 

Products are available on trays and, upon request, on reels for easy pick and place, ESD compliant EXXELIA products offer components compliant to IPC/JEDEC standard J-STD- 020 with TP = 260°C and tP = 30 seconds. 

Yes, Exxelia's magnetic components are designed and manufactured to meet or exceed industry standards and certifications, including RoHS, REACH, and MIL-STD.