Double Section Bobin

Cleaning procedure 

The cleaning of the PCB boards is evolving from solvent (as isopropylic alcohol,...) to highly alkaline water based cleaning medium. EXXELIA has performed an extensive study to offer robust technologies to withstand these current cleaning processes. The qualification procedure has included thermal shock, burn in and mechanical testings. EXXELIA has defined gluing, marking, varnishing processes that allow the products to go through more than 5 cleaning cycles and operating up to 180°C. 

Processes compliant to ESA and NASA outgassing standards have also been defined for products specified up to 140°C. 

Wire integrity 

EXXELIA has qualified specific processes to ensure wire integrity for better insulation. The wire undergoes mechanical, chemical and thermal stresses during the winding and cabling process steps. EXXELIA has set up a dedicated process to reduce the impact of these manufacturing steps and improve the overall reliability of the wires and products. 

Finishing 

EXXELIA offers several types of components: Surface Mounted Device, Through Hole or lead terminations products, system integrated components. 

Packaging 

Products are available on trays and, upon request, on reels for easy pick and place, ESD compliant EXXELIA products offer components compliant to IPC/JEDEC standard J-STD- 020 with TP = 260°C and tP = 30 seconds.