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EXXELIA ACQUIRES MICROPEN TECHNOLOGIES CORPORATION

Exxelia acquires Micropen Technologies Corporation and adds resistors to its high-reliability passive components portfolio

EXXELIA ACQUIRES MICROPEN TECHNOLOGIES CORPORATION AND ADDS RESISTORS TO ITS HIGH-RELIABILITY PASSIVE COMPONENTS PORTFOLIO

 

Micropen, Technology Leader in the Deisgn, Development and Manufacture of High Precision Resistors and Special Sensors Joins Exxelia 

Exxelia Completes its High-Rel Passive Component Portfolio by Adding Resistors to the Existing Capacitors & Magnetic Product Lines and Expands its Offer to Critical Sensors for the Medical & Security markets 

Exxelia Strengthens its Footprint in the USA with a Fourth Manufacturing Facility 

Micropen Scales its Business Outside the USEA Through Exxelia's Local Presence, Especially in Europe and Asia 

 

PARIS, France and HONEOYE FALLS, NY, USA, January 6th, 2020 – Exxelia, a leading designer and manufacturer of High-Rel passive components and sub-systems dedicated to severe environments, announced that it has completed, on Dec 23rd, 2019, the acquisition of Micropen Technologies Corporation. Micropen is a well-established designer and manufacturer of high technology resistors, known under the Ohmcraft® brand, serving the medical, defense, space and industrial markets. Micropen also manufactures with the same technology unique special sensors dedicated to the medical and security markets.

Established in 1982 in Honeoye Falls, NY, Micropen Technologies has developed a unique process to print critical functional materials, such as conductive electrodes, precious metals, on various planar or 3D substrates, such as ceramic, plastic and others. This patented system is the core technology for the design and manufacture of Ohmcraft® complete line of resistors as well as some of the world’s most innovative monitoring & stimulating medical sensors.

“We are very excited to welcome Micropen’s talented, engaged and committed team, and very proud to add Micropen’s unique technology under our already extensive portfolio of highly-engineered passive components and sensors. Thanks to this unrivaled process, Exxelia gains a foothold in the high-rel resistors world and enhances its ability to serve as a key product solution provider to customers with mission-critical applications”, said Paul Maisonnier, Chief Executive Officer of Exxelia.

According to Ed Petrazzolo, President & Chief Executive Officer of Micropen Technologies, “Micropen is delighted to now be a part of Exxelia's growth and expanded product offerings. The commonalities between our two companies in culture, engineering, technology and manufacturing excellence are outstanding and we are excited by the global reach that Exxelia offers to our Ohmcraft resistors and Micropen printing capabilities”.

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About Micropen Technologies: Micropen Technologies Corporation designs, develops, manufactures and sells a line of custom, high-voltage, high performance thick film resistors and precision electronic components utilizing its proprietary electronic printing system. Micropen’s precision resistor line is marketed under the brand name, Ohmcraft, a recognized leader in custom, high performance resistors for the medical, defense, space, detection and test & measurement markets. The Micropen division is an outsourced product development and manufacturer for the medical device and detection markets. For more Information, visit ohmcraft.com and/or micropen.com

About Exxelia: EXXELIA is a leading global designer and manufacturer of high performance passive components and subsystems. Exxelia’s wide products portfolio includes film, tantalum, ceramic and electrolytic capacitors, inductors, transformers, microwave components, position sensors, slip rings and high-precision mechanical parts. Recognized worldwide for its advanced design and technical expertise, EXXELIA develops both “catalog” and “custom” products exclusively serving high-reliability markets such as aerospace, defense, medical, transportation, telecommunication infrastructure and advanced industrial applications. Additional information can be found at https://exxelia.com 

Published on 08 Jan 2020 by Rebecca Charles

HIGH VOLTAGE CERAMIC CAPACITORS BASED ON BRAND NEW DIELECTRIC MATERIAL

No more compromises between stability and capacitance! The brand new C48X material combines most advantages of NPO and X7R dielectrics, enabling the new high power and high frequency ceramic capacitor range to provide great stability in voltage, high capacitance, great dissipation factor and fast charge/discharge. Miniaturization is a driving need for future electronics pieces of equipment. This evolution, true whatever the application, leads Exxelia Technologies (ex-Eurofarad) to develop a brand new high voltage ceramic capacitors range based on a new dielectric material named C48X, combining most of the advantages of NPO and X7R dielectrics. Compared to X7R material, C48X dielectric allows to get the same capacitance values under working voltage with the unrivaled advantage of a very low dissipation factor (less than 5.10-4). Besides, it can also withstand very high dV/dt, up to 10kV/μs, which makes it the solution of choice for pulse and fast charge/discharge applications. Thus capacitors with C48X dielectric appear to be ideally suited for power applications where heat dissipation may be detrimental to performances and reliability. Exxelia Technologies’ capacitors based on the C48X material have been developed from 200V to 5kV with chip sizes ranging from 1812 to 16080, allowing a maximum capacitance value of 10μF 200V (10 times more than with an NPO ceramic). The standard stacked versions are proposed with a maximum capacitance value of 47μF 200V. Regarding the mounting of these capacitors, many configurations are possible to be compatible either with surface mounting or through-hole mounting. All these versions can be suitable for space use and can be designed in order to avoid any whisker growth risk (10% min lead in all tin-lead alloys used). The introduction of the C48X range in the EPPL (European Space Agency Preferred Parts List) for space is in progress for sizes 0603 to 6560 from 100V to 1kV up to size 1210 and up to 5kV until the size 6560). Some typical applications: • 400Hz Aircraft • Defense • Space • Precision/filtering capacitance in thermally challenged environment for AC or DC voltage

What you should know about Ceramic Capacitors ?

▲ What you should know about Ceramic Capacitors ?   1. Materials expert For 50 years and as a market leader, EXXELIA’s comprehensive knowledge of the materials properties and performances have enabled us to design capacitors in Porcelain, NPO, BX, 2C1, BP, X7R and –2200ppm/°C ceramics. > See our capacitors in catalog   2. Custom Designs Our catalog products don’t meet your application?  Based on the valuable experience accumulated over the design of 2,000+ specific ceramic capacitors, you can trust EXXELIA to define a qualitative custom solution in a time effective manner.   3. No Obsolescence Choosing a standard or custom EXXELIA product means you won’t have to worry about obsolescence.   4. Typical Applications Aerospace & Defense: cockpit panels, flight control, radio systems, missile  guidance systems… Space: military and commercial satellites, launcher… Medical: MRI, external defibrillators, implantable devices… Telecommunications: base stations… Oil and gas: drilling tools, MWD, LWD, wellheads…   5. ISO 9001 And AS9100C Quality is at the core of Exxelia’s corporate culture. Each sites has its own certifications.    6. Certifications Capacitors manufactured by EXXELIA comply with American and European standards and meet the requirements of many international standards. For Space qualified parts (ESA QPL), please refer to our catalog «Ceramic capacitors for Space applications».   7. Quality & Reliability EXXELIA is committed to design and manufacture high quality and reliability products. The test cycles reproducing the most adverse operating conditions over extended periods (up to 10 000 hours) have logged to date well over 5.109 hours/°Component. Failure rate data can be provided upon request. 8. Conflict minerals EXXELIA is committed to an approach based on «Conflict Minerals Compliance». This US SEC rule demands complete traceability and a control mechanism for the mineral procurement chain, encouraging importers to buy only «certified» ore. We have discontinued relations with suppliers that procure from the Democratic Republic of the Congo or an adjoining country.   9. Environment EXXELIA is committed to applying a robust environmental policy, from product design through to shipment. To control its environmental footprint and reconcile this with the company’ functional imperatives, our environmental policy provides for the reduction or elimination of hazardous substances. We also focus on compliance with European Union directives and regulations, notably REACH and RoHS. 10. RoHS Compliancy SMD CAPACITORS The capacitor terminations are generally protected by a nickel barrier formed by electrolytic deposit. This barrier gives chip capacitors leaching performance far exceeding the requirements of all applicable standards. The nickel barrier guarantees a minimum resistance to soldering heat for a period of 1 minute at  260°C in a tin-lead (60/40) or tin-lead-silver (62/36/2) bath without noticeable alteration to the solderability. It also allows repeated soldering-unsoldering and the longer soldering times required by reflow techniques. However nickel barrier amplifies thermal shock and is not recommended for chip sizes equal or greater than CNC Y (30 30) - (C 282 to C 288 - CNC 80 to CNC 94). LEADED COMPONENTS As well as for SMD products, leaded capacitors ranges can also be RoHS. These products, which are characterized by the suffix «W» added to the commercial type, are naturally compatible with the soldering alloys used in RoHS mounting technology. The connections coating is generally an alloy SnAg (with a maximum of 4% Ag). However, on a few products that EXXELIA will precise on request, the coating is pure silver.   11. MLCC Structure   12. Equivalent circuit Capacitor is a complex component combining resistive, inductive and capacitive phenomena. A simplified schematic for the equivalent circuit is:   13. Dielectric characteristics  Insulation Resistance (IR) is the resistance measured under DC voltage across the terminals of the capacitor and consists principally of the parallel resistance shown in the equivalent circuit. As capacitance values and hence the area of dielectric increases, the IR decreases and hence the product (C x IR) is often specified in Ω.F or MΩ.µF. The Equivalent Series Resistance (ESR) is the sum of the resistive terms which generate heating when capacitor is used under AC voltage at a given frequency (f). Dissipation factor (DF) is the ration of the apparent power input will turn to heat in the capacitor: DF = 2π f C ESR When a capacitor works under AC voltage, heat power loss (P), expressed in Watt, is equal to: P = 2π f C Vrms2 DF   The series inductance (Ls) is due to the currents running through the electrodes. It can distort the operation of the capacitor at high frequency where the impedance (Z) is given as: Z = Rs + j (Ls.q - 1⁄(C.q)) with q = 2πf When frequency rises, the capacitive component of capacitors is gradually canceled up to the resonance frequency, where : Z = Rs and LsC.q2 = 1 Above this frequency the capacitor behaves like an inductor.   Manufacturing steps > See our capacitors in catalog SMD environmental tests Ceramic chip capacitors for SMD are designed to meet test requirements of CECC 32100 and NF C 93133 standards as specified below in compliance with NF C 20700 and IEC 68 standards: Solderability: NF C 20758, 260°C, bath 62/36/2. Adherence: 5N force. Vibration fatigue test: NF C 20706, 20 g, 10 Hz to 2,000 Hz, 12 cycles of 20 minutes each. Rapid temperature change: NF C 20714, –55°C to + 125°C, 5 cycles. Combined climatic test: IEC 68-2-38. Damp heat: NF C 20703, 93 %, H.R., 40°C. Endurance test: 1,000 hours, 1.5 URC, 125°C. > See our capacitors in catalog   STORAGE OF CHIP CAPACITORS TINNED OR NON TINNED CHIP CAPACITORS Storage must be in a dry environment at a temperature of 20°C with a relative humidity below 50 %, or preferably in a packaging enclosing a desiccant.  STORAGE IN INDUSTRIAL ENVIRONMENT: 2 years for tin dipped chip capacitors, 18 months for tin electroplated chip capacitors, 2 years for non tinned chip capacitors, 3 years for gold plated chip capacitors. STORAGE IN CONTROLLED NEUTRAL NITROGEN ENVIRONMENT: 4 years for tin dipped or electroplated chip capacitors, 4 years for non tinned chip capacitors, 5 years for gold plated chip capacitors. Storage duration should be considered from delivery date and not from batch manufacture date. The tests carried out at final acceptance stage (solderability, susceptibility to solder heat) enable to assess the compatibility to surface mounting of the chips.   LEAD STYLES   SOLDERING ADVICES FOR REFLOW SOLDERING   Large chips above size 2225 are not recommended to be mounted on epoxy board due to thermal expansion coefficient mismatch between ceramic capacitor and epoxy. Where larger sizes are required, it is recommended to use components with ribbon or other adapted leads so as to absorb thermo-mechanical strains. RECOMMENDED FOOTPRINT FOR SMD CAPACITORS  Ceramic is by nature a material which is sensitive both thermally and mechanically. Stresses caused by the physical and thermal properties of the capacitors, substrates and solders are attenuated by the leads. Wave soldering is unsuitable for sizes larger than 2220 and for the higher ends of capacitance ranges due to possible thermal shock (capacitance values given upon request). Infrared and vapor phase reflow, are preferred for high reliability applications as inherent thermo-mechanical strains are lower than those inherent to wave soldering.    SOLDERING ADVICES FOR IRON SOLDERING Attachment with a soldering iron is discouraged due to ceramic brittleness and the process control limitations. In the event that a soldering iron must be used, the following precautions should be observed: Use a substrate with chip footprints big enough to allow putting side by side one end of the capacitor and the iron tip without any contact between this tip and the component, place the capacitor on this footprint, heat the substrate until the capacitor’s temperature reaches 150°C minimum (preheating step, maximum 1°C per second), place the hot iron tip (a flat tip is preferred) on the footprint without, touching the capacitor. Use a regulated iron with a 30 watts maximum, power. The recommended temperature of the iron is 270 ±10°C. The temperature gap between the capacitor and the iron tip must not exceed 120°C, leave the tip on the footprint for a few seconds in order to increase locally the footprint’s temperature, use a cored wire solder and put it down on the iron tip. In a preferred way use Sn/Pb/Ag 62/36/2 alloy, wait until the solder fillet is formed on the capacitor’s termination, take away iron and wire solder, wait a few minutes so that the substrate and capacitor come back down to the preheating temperature, solder the second termination using the same procedure as the first, let the soldered component cool down slowly to avoid any thermal shock.   14. Packaging TAPE AND REEL The films used on the reels correspond to standard IEC 60286-3. Films are delivered on reels in compliance with document IEC 286-3 dated 1991. Minimum quantity is 250 chips. Maximum quantities per reel are as follows: Super 8 reel - Ø 180: 2,500 chips. Super 8 reel - Ø 330: 10,000 chips. Super 12 reel - Ø 180: 1,000 chips. Reel marking complies with CECC 32100 standard: Model. Rated capacitance. Capacitance tolerance. Rated voltage. Batch number.   15. Dimensional characteristics of chips tray packages   16. High Q Capacitors Tape and Reel Packaging Specifications   17. EIA standard capacitance values Following EIA standard, the values and multiples that are indicated in the chart below can be ordered. E48, E96 series and intermediary values are available upon request.   18. EIA capacitance code The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits are significant figures of the capacitance value and the third digit identifies the multiplier. For capacitance value < 10pF, R designates a decimal point.  See examples below:   19. Part marking voltage codes Use the following voltage code chart for part markings: 20. Part marking Tolerance codes Use the following tolerance code chart for part markings:   21. Reliability levels Exxelia proposes different reliability levels for the ceramic capacitors for both NPO and X7R ceramics.   As the world’s leading manufacturer of specific passive components, we stand apart through our ability to quickly evaluate the application specific engineering challenges and provide a cost-effective and efficient solutions. For requirements that cannot be met by catalog products, we offer leading edge solutions in custom configuration: custom geometries, packaging, characteristics, all is possible thanks to our extensive experience and robust development process, while maintaining the highest level of reliability. Where necessary, special testing is done to verify requirements, such as low dielectric absorption, ultra-high insulation resistance, low dissipation factor, stability under temperature cycling or under specified environmental conditions, etc. > See our capacitors in catalog
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