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Exxelia Exhibition List 2019 - as exhibitor

Exxelia Exhibition List 2019 - as exhibitor

We will be exhibiting to the below events:

 

TRADESHOW

Sales Area

Market

Date

City

Country

EMV

EMEA

ELECTRONICS

19-21 March

Stuttgart

Germany

PCIM Europe

EMEA

ELECTRONICS

7-9 May

Nuremberg

Germany

Space Tech Expo US

AMERICAs

Space

21-22 May

Pasadena, CA

US

Intl Microwave Symposium

AMERICAs

ELECTRONICS

2-7 June

Boston, MA

US

More Electric Aircraft

AMERICAs

Aviation

~20 Aug

Seattle, WA

US

European Microwave Week

EMEA

ELECTRONICS

29 Sept - 4 Oct

Paris

France

European Space Power Conference (ESPC)

EMEA

Space

30 Sept - 4 Oct

Juan-les-Pins

France

Space Tech Expo EU

EMEA

Space

19-21 November

Bremen

Germany
Published on 19 Dec 2018 by Alex Hassani

Exxelia Micropen Expands Manufacturing in Honeoye Falls

To accommodate current and future demand for its technologies, Exxelia Micropen has completed construction to expand its Honeoye Falls facility by more than 20 percent. The 9,000-square-foot addition includes 5,000 square feet of new cleanroom space, enabling the company to double the capacity of its manufacturing operations.   Exxelia Micropen utilizes its proprietary technology to “print” ultra-precise lines of conductive inks on three-dimensional and flexible surfaces, including advanced medical devices. The technology is also used to make high-performance resistors for a wide range of demanding applications in aerospace, imaging, and electronics. Since 2017, the company has experienced double-digit growth every year as demand for its innovative engineering, design, and manufacturing services has escalated.   “As we continue to develop new partnerships to meet the unique needs of customers across the globe, we outgrew our space,” “The expansion allows us to boost our production volumes while we continue to provide the innovative technologies and exceptional service and delivery times that our customers have come to rely on.” said Ed Petrazzolo, CEO, Exxelia Micropen.   Exxelia Micropen partnered with Hamilton Stern Construction and Hanlon Architects for the expansion, which began in the spring. In addition to the manufacturing space, the project includes a new lobby, employee breakroom, and more office space. Parking also grew to a total of 140 spaces.   “The expansion of Exxelia Micropen’s facility is a prime example of the success of our Design-Build service, which provides clients with a cohesive, one-stop-shop experience to save time and reduce costs,” said Justin Hamilton, Principal, Hamilton Stern. “Our close partnership with Hanlon Architects, Marathon Engineering, and Exxelia Micropen enabled this project to be completed in roughly 13 months all while fully maintaining the facility’s production volumes. We are grateful for Exxelia Micropen’s trust in our firm to be part of their continued growth.”   “We are proud of what we have built in Honeoye Falls,” said Petrazzolo. “The talented employees we’re able to recruit from the Rochester area are critical to our success, and the expansion only reinforces our commitment to further develop our presence here. We look forward to a long, prosperous future as part of this community.”

CUBISIC HTLP : Exxelia expands its range of low profile aluminum electrolytic capacitors

June 7, 2022 - Paris, France - Exxelia, a global manufacturer of complex passive components and subsystems for harsh environments, is expanding its CUBISIC capacitor range with a HTLP (High Temperature Low Profile) version. This CUBISIC HTLP offers, in a thin rectangular packaging, the highest energy density of capacitors in its class, combined with a high temperature resistance (-55° → +125°C).    CUBISIC HTLP, the new rectangular capacitor range that changes the game  The new range of CUBISIC HTLP by Exxelia clearly stands out! Why?  It offers up to 60% more capacity than any other rectangular electrolytic capacitor on the market, in the same volume, while having a 5,000-hour life span. Covering a temperature range of -55° → +125°C, the CUBISIC HTLP is designed to provide excellent performance in extreme temperatures, compatible with the most severe military and aerospace applications.    Engineers facing complex design requirements and looking for an easily integrated product will gain space and reliability through the use of improved materials fully REACH compliant. The CUBISIC HTLP withstands 20g vibration and is low-pressure qualified, making it compatible to 92,000 feet in altitude. It is ideally suited for integration into cockpits, actuators, and power generation in commercial and military aircraft as well as radar and laser systems.  TECHNICAL SPECIFICATIONS : Capacity from 140μF to 58 000μF Voltage from 7.5V to 350V Service life of 5,000 hours at 125°C Operating temperature -55°C to +125°C 20g vibrations and 92,000 feet altitude  RoHS versions available    

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