INNOVATIVE LOW PASS FILTERS
Exxelia has developed several ranges of miniature filters with different low-pass configuration (C, L, Pi, T, 2xPi, 2xL and 2xT) mainly intended to protect electronic equipment from interferences.
Low-pass filter solutions are mainly used for EMI suppression in electronics systems. Exxelia Technologies (ex-Eurofarad), part of Exxelia Group, has developed several ranges of miniature filters with different low-pass configuration (C, L, Pi, T, 2xPi, 2xL and 2xT) mainly intended to protect electronic equipment from interferences.
Exxelia Technologies produces sophisticated filters assembling Exxelia Group’s manufactured ceramic capacitors (X7R/ NPO) with ferrite inductors or winding cores in a shielding case. This solution’s main benefits are performance, reliability and optimal traceability.
Considering a filter in a shielding case implies a good metallic package to insure high shielding performances with attenuation up to 10 GHz. Among options, Exxelia offers glass sealing, steel or kovar package using tin, silver or gold plating treatments to withstand any thermally or mechanically challenged applicaiton.
Exxelia offers innovative EMI suppression filter solutions providing great shielding performance including the FC030 feedthrough mounted on shielding enclosure and FCM030 series designed to prevent EMI on printed circuit board.
FC030 series is feedthrough filter allowing to prevent not only EMI conduction but also EMI radiation on power supply or data signals designs up to 200V. FC030 insertion loss can be 20dB at 1MHz to reach 70dB up to 10 GHz. FC030 series is extremely performant on low frequencies applications.
On the other hand, FC030 can offer very low capacitance values starting from 5pF allowing to protect high bandwidth data signals. Operating temperature from -55C° up to +175C°. FC030 series is ESA qualified.
FCM030 features same design and performances’ as FC030 and is intended for surface mount devices. FCM030 is packaged in full metallic silver plated allowing optimal contact with ground plane that improves the interferences flow to the ground.
The series particularly fit for amplifiers, radars, sensitive HMI, accurate measuring.
Exxelia Ohmcraft High Voltage Chip Dividers Enable Design Flexibility for Manufacturers of Semiconductor Equipment
Exxelia Ohmcraft High Voltage Chip Dividers Enable Design Flexibility for Manufacturers of Semiconductor Equipment ROCHESTER, N.Y., September 17, 2021—Microchips—also known as semiconductors—are critical to the function of everyday technologies like mobile phones, computers, radios, and televisions. To finetune the outputs of their main power supply, manufacturers of semiconductor production equipment have leveraged custom resistors from Exxelia Ohmcraft for more than 25 years for their high precision, high voltage and stability. Exxelia Ohmcraft’s custom surface mount resistors and dividers offer semiconductor equipment engineers with maximum design flexibility in the smallest footprint, as they have the ability to specify both the resistance value of a surface mount divider and the divider ratio. This allows engineers to produce the necessary voltage and current required to create the highest-quality end products. “Traditionally, high-voltage dividers are made using two different resistors, but our high voltage chip dividers integrate them into one part,” said Eric Van Wormer, Vice President of Exxelia Ohmcraft. “We always work closely with our customers to ensure that we meet the specific design requirements necessary to create their quality technologies.” Exxelia Ohmcraft’s technology utilizes the proprietary Micropen electronic printing system to “print” precise, narrow, serpentine lines with resistive ink on a ceramic substrate, producing higher performance resistors over a wider range of values on a smaller surface area than is possible with conventional film resistor technology. # # # About Exxelia Ohmcraft Exxelia Ohmcraft’s thick-film, surface mount resistors are engineered to meet application-specific needs. Our proprietary Micropen printing technology is the foundation for Exxelia Ohmcraft’s family of resistor products. Exxelia Ohmcraft’s precision leaded resistors are manufactured with our patented Micropen technology to create a unique serpentine design that withstands voltages up to 100kV and provides an unmatched level of performance and stability. For more information, visit Ohmcraft.com. About Exxelia Exxelia is a leading global designer and manufacturer of high-performance passive components and subsystems. Exxelia’s wide products portfolio includes film, tantalum, ceramic and electrolytic capacitors, inductors, transformers, microwave components, position sensors, slip rings and high-precision mechanical parts. Recognized worldwide for its advanced design and technical expertise, Exxelia develops both “catalog” and “custom” products exclusively serving high-reliability markets such as aerospace, defense, medical, transportation, telecommunication infrastructure and advance industrial applications. Additional information can be found at https://exxelia.com.
What you should know about Ceramic Capacitors ?
▲ What you should know about Ceramic Capacitors ? 1. Materials expert For 50 years and as a market leader, EXXELIA’s comprehensive knowledge of the materials properties and performances have enabled us to design capacitors in Porcelain, NPO, BX, 2C1, BP, X7R and –2200ppm/°C ceramics. > See our capacitors in catalog 2. Custom Designs Our catalog products don’t meet your application? Based on the valuable experience accumulated over the design of 2,000+ specific ceramic capacitors, you can trust EXXELIA to define a qualitative custom solution in a time effective manner. 3. No Obsolescence Choosing a standard or custom EXXELIA product means you won’t have to worry about obsolescence. 4. Typical Applications Aerospace & Defense: cockpit panels, flight control, radio systems, missile guidance systems… Space: military and commercial satellites, launcher… Medical: MRI, external defibrillators, implantable devices… Telecommunications: base stations… Oil and gas: drilling tools, MWD, LWD, wellheads… 5. ISO 9001 And AS9100C Quality is at the core of Exxelia’s corporate culture. Each sites has its own certifications. 6. Certifications Capacitors manufactured by EXXELIA comply with American and European standards and meet the requirements of many international standards. For Space qualified parts (ESA QPL), please refer to our catalog «Ceramic capacitors for Space applications». 7. Quality & Reliability EXXELIA is committed to design and manufacture high quality and reliability products. The test cycles reproducing the most adverse operating conditions over extended periods (up to 10 000 hours) have logged to date well over 5.109 hours/°Component. Failure rate data can be provided upon request. 8. Conflict minerals EXXELIA is committed to an approach based on «Conflict Minerals Compliance». This US SEC rule demands complete traceability and a control mechanism for the mineral procurement chain, encouraging importers to buy only «certified» ore. We have discontinued relations with suppliers that procure from the Democratic Republic of the Congo or an adjoining country. 9. Environment EXXELIA is committed to applying a robust environmental policy, from product design through to shipment. To control its environmental footprint and reconcile this with the company’ functional imperatives, our environmental policy provides for the reduction or elimination of hazardous substances. We also focus on compliance with European Union directives and regulations, notably REACH and RoHS. 10. RoHS Compliancy SMD CAPACITORS The capacitor terminations are generally protected by a nickel barrier formed by electrolytic deposit. This barrier gives chip capacitors leaching performance far exceeding the requirements of all applicable standards. The nickel barrier guarantees a minimum resistance to soldering heat for a period of 1 minute at 260°C in a tin-lead (60/40) or tin-lead-silver (62/36/2) bath without noticeable alteration to the solderability. It also allows repeated soldering-unsoldering and the longer soldering times required by reflow techniques. However nickel barrier amplifies thermal shock and is not recommended for chip sizes equal or greater than CNC Y (30 30) - (C 282 to C 288 - CNC 80 to CNC 94). LEADED COMPONENTS As well as for SMD products, leaded capacitors ranges can also be RoHS. These products, which are characterized by the suffix «W» added to the commercial type, are naturally compatible with the soldering alloys used in RoHS mounting technology. The connections coating is generally an alloy SnAg (with a maximum of 4% Ag). However, on a few products that EXXELIA will precise on request, the coating is pure silver. 11. MLCC Structure 12. Equivalent circuit Capacitor is a complex component combining resistive, inductive and capacitive phenomena. A simplified schematic for the equivalent circuit is: 13. Dielectric characteristics Insulation Resistance (IR) is the resistance measured under DC voltage across the terminals of the capacitor and consists principally of the parallel resistance shown in the equivalent circuit. As capacitance values and hence the area of dielectric increases, the IR decreases and hence the product (C x IR) is often specified in Ω.F or MΩ.µF. The Equivalent Series Resistance (ESR) is the sum of the resistive terms which generate heating when capacitor is used under AC voltage at a given frequency (f). Dissipation factor (DF) is the ration of the apparent power input will turn to heat in the capacitor: DF = 2π f C ESR When a capacitor works under AC voltage, heat power loss (P), expressed in Watt, is equal to: P = 2π f C Vrms2 DF The series inductance (Ls) is due to the currents running through the electrodes. It can distort the operation of the capacitor at high frequency where the impedance (Z) is given as: Z = Rs + j (Ls.q - 1⁄(C.q)) with q = 2πf When frequency rises, the capacitive component of capacitors is gradually canceled up to the resonance frequency, where : Z = Rs and LsC.q2 = 1 Above this frequency the capacitor behaves like an inductor. Manufacturing steps > See our capacitors in catalog SMD environmental tests Ceramic chip capacitors for SMD are designed to meet test requirements of CECC 32100 and NF C 93133 standards as specified below in compliance with NF C 20700 and IEC 68 standards: Solderability: NF C 20758, 260°C, bath 62/36/2. Adherence: 5N force. Vibration fatigue test: NF C 20706, 20 g, 10 Hz to 2,000 Hz, 12 cycles of 20 minutes each. Rapid temperature change: NF C 20714, –55°C to + 125°C, 5 cycles. Combined climatic test: IEC 68-2-38. Damp heat: NF C 20703, 93 %, H.R., 40°C. Endurance test: 1,000 hours, 1.5 URC, 125°C. > See our capacitors in catalog STORAGE OF CHIP CAPACITORS TINNED OR NON TINNED CHIP CAPACITORS Storage must be in a dry environment at a temperature of 20°C with a relative humidity below 50 %, or preferably in a packaging enclosing a desiccant. STORAGE IN INDUSTRIAL ENVIRONMENT: 2 years for tin dipped chip capacitors, 18 months for tin electroplated chip capacitors, 2 years for non tinned chip capacitors, 3 years for gold plated chip capacitors. STORAGE IN CONTROLLED NEUTRAL NITROGEN ENVIRONMENT: 4 years for tin dipped or electroplated chip capacitors, 4 years for non tinned chip capacitors, 5 years for gold plated chip capacitors. Storage duration should be considered from delivery date and not from batch manufacture date. The tests carried out at final acceptance stage (solderability, susceptibility to solder heat) enable to assess the compatibility to surface mounting of the chips. LEAD STYLES SOLDERING ADVICES FOR REFLOW SOLDERING Large chips above size 2225 are not recommended to be mounted on epoxy board due to thermal expansion coefficient mismatch between ceramic capacitor and epoxy. Where larger sizes are required, it is recommended to use components with ribbon or other adapted leads so as to absorb thermo-mechanical strains. RECOMMENDED FOOTPRINT FOR SMD CAPACITORS Ceramic is by nature a material which is sensitive both thermally and mechanically. Stresses caused by the physical and thermal properties of the capacitors, substrates and solders are attenuated by the leads. Wave soldering is unsuitable for sizes larger than 2220 and for the higher ends of capacitance ranges due to possible thermal shock (capacitance values given upon request). Infrared and vapor phase reflow, are preferred for high reliability applications as inherent thermo-mechanical strains are lower than those inherent to wave soldering. SOLDERING ADVICES FOR IRON SOLDERING Attachment with a soldering iron is discouraged due to ceramic brittleness and the process control limitations. In the event that a soldering iron must be used, the following precautions should be observed: Use a substrate with chip footprints big enough to allow putting side by side one end of the capacitor and the iron tip without any contact between this tip and the component, place the capacitor on this footprint, heat the substrate until the capacitor’s temperature reaches 150°C minimum (preheating step, maximum 1°C per second), place the hot iron tip (a flat tip is preferred) on the footprint without, touching the capacitor. Use a regulated iron with a 30 watts maximum, power. The recommended temperature of the iron is 270 ±10°C. The temperature gap between the capacitor and the iron tip must not exceed 120°C, leave the tip on the footprint for a few seconds in order to increase locally the footprint’s temperature, use a cored wire solder and put it down on the iron tip. In a preferred way use Sn/Pb/Ag 62/36/2 alloy, wait until the solder fillet is formed on the capacitor’s termination, take away iron and wire solder, wait a few minutes so that the substrate and capacitor come back down to the preheating temperature, solder the second termination using the same procedure as the first, let the soldered component cool down slowly to avoid any thermal shock. 14. Packaging TAPE AND REEL The films used on the reels correspond to standard IEC 60286-3. Films are delivered on reels in compliance with document IEC 286-3 dated 1991. Minimum quantity is 250 chips. Maximum quantities per reel are as follows: Super 8 reel - Ø 180: 2,500 chips. Super 8 reel - Ø 330: 10,000 chips. Super 12 reel - Ø 180: 1,000 chips. Reel marking complies with CECC 32100 standard: Model. Rated capacitance. Capacitance tolerance. Rated voltage. Batch number. 15. Dimensional characteristics of chips tray packages 16. High Q Capacitors Tape and Reel Packaging Specifications 17. EIA standard capacitance values Following EIA standard, the values and multiples that are indicated in the chart below can be ordered. E48, E96 series and intermediary values are available upon request. 18. EIA capacitance code The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits are significant figures of the capacitance value and the third digit identifies the multiplier. For capacitance value < 10pF, R designates a decimal point. See examples below: 19. Part marking voltage codes Use the following voltage code chart for part markings: 20. Part marking Tolerance codes Use the following tolerance code chart for part markings: 21. Reliability levels Exxelia proposes different reliability levels for the ceramic capacitors for both NPO and X7R ceramics. As the world’s leading manufacturer of specific passive components, we stand apart through our ability to quickly evaluate the application specific engineering challenges and provide a cost-effective and efficient solutions. For requirements that cannot be met by catalog products, we offer leading edge solutions in custom configuration: custom geometries, packaging, characteristics, all is possible thanks to our extensive experience and robust development process, while maintaining the highest level of reliability. Where necessary, special testing is done to verify requirements, such as low dielectric absorption, ultra-high insulation resistance, low dissipation factor, stability under temperature cycling or under specified environmental conditions, etc. > See our capacitors in catalog