Exxelia joins Heico Corporation group
Exxelia is turning a page in its shareholder history and should join the American group HEICO Corporation via its subsidiary Electronic Technologies Group (ETG).
The transaction will be carried out with IK Partners, majority shareholder of Exxelia since 2015, and should take place before the end of the first quarter of 2023.
Laurans A. Mendelson, HEICO's Chairman and Chief Executive Officer, along with Victor H. Mendelson, HEICO's Co-President and CEO of its Electronic Technologies Group, commented, "We are ecstatic that such a fine company, with its remarkable team members, management and products, will be part of HEICO, and we look forward to welcoming all of Exxelia's great people to the HEICO family. While furthering HEICO's strategy of expanding our already impressive range of mission-critical and Hi-Rel components for the most demanding applications, Exxelia also provides HEICO with added broad geographic and product diversity, including in the important European market."
Paul Maisonnier, CEO of Exxelia, commented, "We are excited to embark on a new stage of development with HEICO. We really appreciate the values of the Mendelson Family, which match perfectly those of Exxelia. Our goal to develop Exxelia into a world leader in Hi-Rel passive components and sub-systems for harsh environments, serving the aeronautic, defense, space and medical markets will be accelerated under the HEICO umbrella. Together we will strengthen our innovation and operational capabilities and accelerate our internationalisation strategy. We thank IK for their support over the past years, which has enabled us to establish a solid platform to support our ambitions for global growth."
Dan Soudry, Managing Partner at IK Partners and Advisor to the IK VII Fund, and Diki Korniloff, Partner at IK Partners, added: "As shareholders of Exxelia since 2015, we are very pleased to have been able to support its very talented management team through the various stages of transformation, structuring and growth of the Company, doubling its employee base to more than 2,100 people and leading to a strong increase in investment in R&D and in its manufacturing footprint. Notably, we believe that HEICO is an excellent home for Exxelia given that they share common values and we are very pleased HEICO is acquiring Exxelia. We'd like to take this opportunity to wish the team and HEICO all the very best for the future."
About HEICO Corporation
HEICO Corporation is engaged primarily in the design, production, servicing and distribution of products and services to certain niche segments of the aviation, defense, space, medical, telecommunications and electronics industries through its Hollywood, Florida-based Flight Support Group and its Miami, Florida-based Electronic Technologies Group. HEICO's customers include a majority of the world's airlines and overhaul shops, as well as numerous defense and space contractors and military agencies worldwide, in addition to medical, telecommunications and electronics equipment manufacturers.
For more information about HEICO, please visit website : www.heico.com.
Exxelia Micropen Expands Manufacturing in Honeoye Falls
To accommodate current and future demand for its technologies, Exxelia Micropen has completed construction to expand its Honeoye Falls facility by more than 20 percent. The 9,000-square-foot addition includes 5,000 square feet of new cleanroom space, enabling the company to double the capacity of its manufacturing operations. Exxelia Micropen utilizes its proprietary technology to “print” ultra-precise lines of conductive inks on three-dimensional and flexible surfaces, including advanced medical devices. The technology is also used to make high-performance resistors for a wide range of demanding applications in aerospace, imaging, and electronics. Since 2017, the company has experienced double-digit growth every year as demand for its innovative engineering, design, and manufacturing services has escalated. “As we continue to develop new partnerships to meet the unique needs of customers across the globe, we outgrew our space,” “The expansion allows us to boost our production volumes while we continue to provide the innovative technologies and exceptional service and delivery times that our customers have come to rely on.” said Ed Petrazzolo, CEO, Exxelia Micropen. Exxelia Micropen partnered with Hamilton Stern Construction and Hanlon Architects for the expansion, which began in the spring. In addition to the manufacturing space, the project includes a new lobby, employee breakroom, and more office space. Parking also grew to a total of 140 spaces. “The expansion of Exxelia Micropen’s facility is a prime example of the success of our Design-Build service, which provides clients with a cohesive, one-stop-shop experience to save time and reduce costs,” said Justin Hamilton, Principal, Hamilton Stern. “Our close partnership with Hanlon Architects, Marathon Engineering, and Exxelia Micropen enabled this project to be completed in roughly 13 months all while fully maintaining the facility’s production volumes. We are grateful for Exxelia Micropen’s trust in our firm to be part of their continued growth.” “We are proud of what we have built in Honeoye Falls,” said Petrazzolo. “The talented employees we’re able to recruit from the Rochester area are critical to our success, and the expansion only reinforces our commitment to further develop our presence here. We look forward to a long, prosperous future as part of this community.”
Magnetic Components based on Adaptive CCM Technology at APEC – Booth# 653 –
Exxelia will exhibit the CCM series during the Applied Power Electronics Conference at Exxelia’s booth #623 from March 27-30, 2017 in Tampa, FL. Exxelia designed CCM technology to respond to the growing interest of electronic engineers for inductors and transformers with multiple outputs, high power density and reduced footprint. Qualified for aeronautic and space applications, the CCM product line features terrific robustness. The monolithic design provides high mechanical performance, proven by the successfully testing in accordance with MIL-STD-202 (methods 213 and 204). The series offers five different sizes, allowing optimized component design in a pick-and-place surface mount (SMD) package. Through-hole (TH) packages are also available upon request. The CCM series is particularly flexible with a number of pins options available, from 2×6 pins for the smallest package, up to 2×10. CCM transformers and inductors can operate over a wide temperature range with a minimal temperature of -55° C. The standard thermal grade of the technology is 140° C. Thanks to the technology design, the thermal resistance is 30% lower than standard industrial components. The epoxy molding protecting the winding ensures a lower temperature gradient and a better heat dissipation. Each unit is thoroughly tested with a dielectric withstanding strength of 1,500 VAC. Component materials meet UL 94-V0 rating. Exxelia can evaluate losses and related temperature rise thanks to an in-depth knowledge of CCM technology. Thermal resistance data is available for each package size. Exxelia can also manufacture products in CCM technology according to MIL-STD-981.