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Exxelia at SIAE 2023 (Paris Air Show)

Exxelia is pleased to exhibit at SIAE 2023 (Paris Air Show) in Le Bourget, France from June 19 to 25, 2023. Visit our booth 2B - H 107. Discover how our innovative solutions could serve your offering.

SIAE 2023As an expert in high reliability products in a wide range of fields, Exxelia will be exhibiting its products this year.  

On its "Embedded Products" cluster, bringing together components that can be mounted on a satellite or aircraft, Exxelia will be presenting two innovations that are particularly well suited to the challenges of the aviation of the future and the objectives of decarbonisation of the air. Its latest film capacitor innovation called MML™ (named after its "Miniature Micro-Layer" dielectric) shows an energy density up to 4 times higher than other film dielectrics. MML® technology makes power capacitors smaller, lighter and compatible with higher temperatures, and is therefore particularly suitable for DC-Link, decoupling & charge-discharge applications.

 

Exxelia Paris Air ShowAlongside MML™ components, Exxelia will also be exhibiting the latest innovations in magnetic components, saving up to 40% in weight and 20% in volume while dissipating more power, some of which have been designed for eVTOL applications, as well as the CCM & Dual Active Bridge multi-output transformers.

 

Come and discover the latest innovations from Exxelia at our booth during the event. We have a range of high-quality products (Capacitors, Filters, Magnetics, Materials & Tuning Components, Position Sensors, Ohmcraft Resistors, Slip Rings & Rotary Joints) designed to meet the needs of your industry. We can't wait to show you how our solutions can improve your projects and increase your efficiency.

 

Don't miss the opportunity to meet our team of experts and find out how we can help you achieve your goals. Join us at our booth for an enlightening experience.

 

 

SIAE 2023

Exxelia France Relance

 

 

 

 

 

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Published on 15 May 2023 by Stephane PERES

New Ultra-Broadband Capacitor Series

Exxelia launches its three new Ultra-Broadband Capacitor Series at European Microwave Week 2019 in Paris August 26th, 2019 – Paris, France - Exxelia, a leading global designer and manufacturer of high reliability passive components  pleased to announce the launch of its new ultra-broadband series UBZ, UBL and XBL at the European Microwave Week tradeshow in Paris from October 1-3, 2019. Thanks to its strong experience in MLCC manufacturing, Exxelia extends its RF capacitors product offer by developing the three ultra-broadband series XBL, UBL and UBZ.  Available in standard EIA sizes compatible with SMT pick & place and with any soldering processes thanks to its highly reliable ceramic material, Exxelia new ultra-broadband series ensure an ultra-low insertion loss and excellent return loss over a wide bandwidth up to 40GHz. TECHNICAL CHARACTERISTICS                                                           CIRCUIT APPLICATIONS EIA 0201 and 0402 Case sizes                                                       DC Blocking, Coupling and Bypassing Capacitance: 100nF Low insertion loss up to 40 GHz RoHS Compliant APPLICATIONS Optoelectronics / High-speed data Broadband test equipment & applications Broadband microwave / millimeter wave amplifiers and oscillators The XBL, UBL and UBZ Ultra-Broadband series are now available for orders.  

50th anniversary of our Pessac manufacturing site

Our manufacturing site in Pessac is one of the 12 industrial sites of Exxelia. It has approximately 130 employees. “We produce essential but inexpensive parts, but we produce 50 million a year! And we have a year of visibility on our order books", "We produce parts in complex alloys here, but also our own recipes for insulating ceramics", assures Mickaël Pelé, Director of the Exxelia Pessac factory. This factory was founded in Pessac half a century ago: it is an integral part of the life of the City and the Region, which have actively participated in its development. Perfectly inserted into the local ecosystem, there are numerous interactions with neighboring institutions, laboratories, universities, schools and businesses. The Pessac factory was built in 1971 and inaugurated in September 1972. Its creation was initiated by Jean-Claude Asscher, President of the Tekelec-Airtronic group. Initially dedicated to distribution, the Tekelec-Airtronic group launched into manufacturing under license to then develop and industrialize its own products. Its development followed that of electronics, telecommunications and IT in France and around the world. The group will reach a significant size: in 1992, with 20 companies employing 3,000 people in different countries, its turnover will exceed one billion dollars. The Pessac plant remained associated with the group until the early 2000s.   Here is a retrospective of the event in video:

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